Sockets for ICs, Transistors - MX-CHIPS ELECTRONICS LIMITED

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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-91-098-13-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3158	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	98 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-656-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3462	- + Add To Cart Inquiry Now		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
117-93-656-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3838	- + Add To Cart Inquiry Now		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
123-13-950-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	2801	- + Add To Cart Inquiry Now	Datasheet	Tube	123	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-628-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2495	- + Add To Cart Inquiry Now		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-650-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2070	- + Add To Cart Inquiry Now		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-650-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2866	- + Add To Cart Inquiry Now		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
60-9503-20 CONN IC DIP SOCKET 60POS GOLD Aries Electronics	2117	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	60 (2 x 30)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
60-9503-30 CONN IC DIP SOCKET 60POS GOLD Aries Electronics	3990	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	60 (2 x 30)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
322-13-164-41-001000 SOCKET 2 LEVEL WRAPOST SIP 64POS Mill-Max Manufacturing Corp.	3600	- + Add To Cart Inquiry Now	Datasheet	Tube	322	Active	SIP	64 (1 x 64)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-C182-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2029	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3345	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2636	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3148	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3829	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3702	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-41-100-13-062001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3025	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	100 (13 x 13)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-100-10-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2016	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	100 (10 x 10)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-100-13-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3007	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	100 (13 x 13)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-100-10-000001 SOCKET SOLDERTAIL 100-PGA Mill-Max Manufacturing Corp.	2987	- + Add To Cart Inquiry Now		Tube	510	Active	PGA	100 (10 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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