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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
22-4508-31

22-4508-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2813
- +

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22-4508-31

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-43-950-61-001000

111-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2442
- +

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111-93-950-61-001000

111-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3771
- +

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Tube * Active - - - - - - - - - - - - - -
517-83-401-19-101111

517-83-401-19-101111

CONN SOCKET PGA 401POS GOLD

Preci-Dip

3528
- +

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517-83-401-19-101111

Datasheet

Bulk 517 Active PGA 401 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-064-10-051001

510-93-064-10-051001

SOCKET SOLDERTAIL 64-PGA

Mill-Max Manufacturing Corp.

2326
- +

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Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-08-000001

510-93-064-08-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3047
- +

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510-93-064-08-000001

Datasheet

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-08-000002

510-93-064-08-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2258
- +

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510-93-064-08-000002

Datasheet

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-08-000003

510-93-064-08-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2149
- +

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510-93-064-08-000003

Datasheet

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-10-051002

510-93-064-10-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3970
- +

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510-93-064-10-051002

Datasheet

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-10-051003

510-93-064-10-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3404
- +

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510-93-064-10-051003

Datasheet

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-952-61-001000

115-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3112
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-952-61-001000

115-93-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3345
- +

Add To Cart

Inquiry Now

Tube * Active - - - - - - - - - - - - - -
110-43-632-61-801000

110-43-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3388
- +

Add To Cart

Inquiry Now

Tube * Active - - - - - - - - - - - - - -
110-93-632-61-801000

110-93-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2906
- +

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Tube * Active - - - - - - - - - - - - - -
30-9503-21

30-9503-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2366
- +

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30-9503-21

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-31

30-9503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3112
- +

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30-9503-31

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM11010-40

84-PGM11010-40

CONN SOCKET PGA GOLD

Aries Electronics

2462
- +

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84-PGM11010-40

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-648-61-006000

116-43-648-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2973
- +

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116-93-648-61-006000

116-93-648-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3480
- +

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32-3503-21

32-3503-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2481
- +

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32-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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