Sockets for ICs, Transistors - MX-CHIPS ELECTRONICS LIMITED

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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
20-6503-31 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	2388	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.6 (15.24mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
APA-320-G-B ADAPTER PLUG Samtec Inc.	2263	- + Add To Cart Inquiry Now		Bulk	APA	Active	-	20 (2 x 10)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
32-6556-20 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	2151	- + Add To Cart Inquiry Now	Datasheet	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
32-6556-30 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3967	- + Add To Cart Inquiry Now	Datasheet	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
26-81250-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	3382	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-81250-610C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	3010	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-8350-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	2901	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-8530-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	3476	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-8900-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	2679	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-8975-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	2965	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-8984-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	2789	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-133-14-071101 PGA SOLDER TAIL Preci-Dip	3051	- + Add To Cart Inquiry Now	Datasheet	Bulk	550	Active	PGA	133 (14 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
605-93-950-11-480000 SOCKET CARRIER LOWPRO .900 50POS Mill-Max Manufacturing Corp.	2886	- + Add To Cart Inquiry Now	Datasheet	Tube	605	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-950-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	3279	- + Add To Cart Inquiry Now	Datasheet	Tube	605	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-642-41-001000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	3735	- + Add To Cart Inquiry Now	Datasheet	Tube	121	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-820-90 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	2839	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
18-822-90 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	2991	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
26-8450-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	2437	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
26-8500-310C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	3212	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	26 (2 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
124-PGM13009-10 CONN SOCKET PGA GOLD Aries Electronics	2751	- + Add To Cart Inquiry Now	Datasheet	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

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