Sockets for ICs, Transistors - MX-CHIPS ELECTRONICS LIMITED

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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
08-0518-10 CONN SOCKET SIP 8POS GOLD Aries Electronics	6393	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	SIP	8 (1 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-00 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	4711	- + Add To Cart Inquiry Now	Datasheet	Tube	518	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-10 CONN SOCKET SIP 25POS GOLD Aries Electronics	3170	- + Add To Cart Inquiry Now	Datasheet	Bulk	0513	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-0518-10 CONN SOCKET SIP 40POS GOLD Aries Electronics	6256	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	SIP	40 (1 x 40)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-2810-90 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	1272	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
169-PRS13001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	135	- + Add To Cart Inquiry Now	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
225-PRS15001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	127	- + Add To Cart Inquiry Now	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	225 (15 x 15)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
289-PRS17001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3350	- + Add To Cart Inquiry Now	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
361-PRS19001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3657	- + Add To Cart Inquiry Now	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
441-PRS21001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3081	- + Add To Cart Inquiry Now	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
08-3518-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3837	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-10T CONN SOCKET SIP 5POS GOLD Aries Electronics	2258	- + Add To Cart Inquiry Now	Datasheet	Bulk	0513	Active	SIP	5 (1 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-10 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	1116	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-10 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3827	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-10 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3690	- + Add To Cart Inquiry Now	Datasheet	Tube	518	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-10 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	1152	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	294	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-10 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	1713	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-10 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	278	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-10 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2064	- + Add To Cart Inquiry Now	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

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