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图片 型号 # 库存 数量 数据表 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
324-PRS18001-12

324-PRS18001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3673
- +

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324-PRS18001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
262-PLS20003-12

262-PLS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3838
- +

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262-PLS20003-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
262-PRS20003-12

262-PRS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2171
- +

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262-PRS20003-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
40-6551-18

40-6551-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3341
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-6552-18

40-6552-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2191
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-6553-18

40-6553-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2933
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3554-18

40-3554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2092
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-3575-18

32-3575-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3659
- +

添加到购物车

立即咨询

32-3575-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-6575-18

32-6575-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2019
- +

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立即咨询

32-6575-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
200-6325-9UN-1900

200-6325-9UN-1900

CONN SOCKET PGA ZIF 625POS GOLD

3M

3121
- +

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立即咨询

200-6325-9UN-1900

Datasheet

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 625 (25 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
361-PLS19001-12

361-PLS19001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3545
- +

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立即咨询

361-PLS19001-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
300-PLS20006-12

300-PLS20006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2365
- +

添加到购物车

立即咨询

300-PLS20006-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
300-PRS20006-12

300-PRS20006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3187
- +

添加到购物车

立即咨询

300-PRS20006-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
299-PLS20009-12

299-PLS20009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2842
- +

添加到购物车

立即咨询

299-PLS20009-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
299-PRS20009-12

299-PRS20009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2650
- +

添加到购物车

立即咨询

299-PRS20009-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
28-6554-18

28-6554-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2723
- +

添加到购物车

立即咨询

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
336-PLS20019-12

336-PLS20019-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3665
- +

添加到购物车

立即咨询

336-PLS20019-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
336-PLS20021-12

336-PLS20021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2157
- +

添加到购物车

立即咨询

336-PLS20021-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
336-PRS20019-12

336-PRS20019-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3788
- +

添加到购物车

立即咨询

336-PRS20019-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
336-PRS20021-12

336-PRS20021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2470
- +

添加到购物车

立即咨询

336-PRS20021-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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