Продукты - Компания MX

Производитель. Часть #	Акции	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
1109681-328 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3569	- + Добавить Расследования	Datasheet	Bulk	-	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-624 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2168	- + Добавить Расследования	Datasheet	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-628 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2131	- + Добавить Расследования	Datasheet	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-632 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	2151	- + Добавить Расследования	Datasheet	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-648 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2361	- + Добавить Расследования	Datasheet	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
69802-452LF CONN SOCKET PLCC 52POS TIN Amphenol ICC (FCI)	3354	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)
ASU02DXTB CONN SOCKET AXIAL 2POS GOLD Sullins Connector Solutions	3688	- + Добавить Расследования		Tray	-	Obsolete	Axial	2 (Rectangular)	-	Gold	10.0µin (0.25µm)	-	Through Hole	Board Guide	Solder	-	Gold	10.0µin (0.25µm)	-	-
54020-68030LF CONN SOCKET PLCC 68POS TIN Amphenol ICC (FCI)	2377	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)
54020-52030LF CONN SOCKET PLCC 52POS TIN Amphenol ICC (FCI)	2822	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)
54020-84030LF CONN SOCKET PLCC 84POS TIN Amphenol ICC (FCI)	2978	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)
A22-LC-TR-R CONN IC DIP SOCKET 22POS TIN Assmann WSW Components	2423	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A22-LC-TT CONN IC DIP SOCKET 6POS TIN Assmann WSW Components	3181	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
AW127-20/Z-T-R SOCKET 20 CONTACTS SINGLE ROW Assmann WSW Components	2637	- + Добавить Расследования	Datasheet	Bulk	-	Obsolete	-	20 (1 x 20)	0.100 (2.54mm)	Nickel	78.7µin (2.00µm)	Brass	Through Hole	-	Solder	0.100 (2.54mm)	Nickel	78.7µin (2.00µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
AR06-HZW/T-R CONN IC DIP SOCKET 6POS TIN Assmann WSW Components	3643	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester, Glass Filled
AR32-HZW/T-R CONN IC DIP SOCKET 32POS TIN Assmann WSW Components	2302	- + Добавить Расследования	Datasheet	Tube	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester, Glass Filled
0475960532 CONN SOCKET LGA 1156POS GOLD Molex	2580	- + Добавить Расследования	Datasheet	Tray	47596	Obsolete	LGA	1156 (40 x 40)	0.036 (0.91mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.036 (0.91mm)	-	-	-	Thermoplastic
0475962032 CONN SOCKET LGA 1155POS Molex	3996	- + Добавить Расследования		Tray	47596	Obsolete	LGA	-	-	-	-	-	-	-	-	-	-	-	-	-
0787250002 CONN CAMERA SOCKET 18POS GOLD Molex	2238	- + Добавить Расследования	Datasheet	Tray	78725	Obsolete	Camera Socket	18 (2 x 9)	-	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	-	Gold	Flash	Copper Alloy	Thermoplastic
1051631001 SMIA65 CAMERA SOCKET CONTACT Molex	3203	- + Добавить Расследования	Datasheet	Tape & Reel (TR)	105163	Obsolete	Camera Socket	12 (2 x 6)	0.037 (0.95mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount, Through Board	Open Frame	Solder	0.037 (0.95mm)	Gold	Flash	Copper Alloy	Thermoplastic
1051670001 SMIA65 TOP MNT CAMERA SOCKET Molex	3302	- + Добавить Расследования	Datasheet	Tape & Reel (TR)	105167	Obsolete	Camera Socket	12 (2 x 6)	0.037 (0.95mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	Gold	Flash	Copper Alloy	Thermoplastic