Продукты - Компания MX

Производитель. Часть #	Акции	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
48-3553-16 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2432	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6551-16 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2009	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6552-16 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2751	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6553-16 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	3728	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3554-16 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2387	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6554-16 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2752	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
234-3034-01-0602 CONN ZIG-ZAG ZIF 34POS GOLD 3M	2598	- + Добавить Расследования	Datasheet	Bulk	Textool™	Active	Zig-Zag, ZIF (ZIP)	34 (1 x 34)	0.050 (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled
558-10-652M35-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	2733	- + Добавить Расследования	Datasheet	Bulk	558	Active	PGA	652 (35 x 35)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
550-10-361-18-101135 PGA SOLDER TAIL Preci-Dip	3871	- + Добавить Расследования	Datasheet	Bulk	550	Active	PGA	361 (18 x 18)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
80-PRS15072-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3156	- + Добавить Расследования	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
191-PGM18015-10T CONN SOCKET PGA TIN Aries Electronics	2168	- + Добавить Расследования	Datasheet	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
120-PLS13015-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3370	- + Добавить Расследования	Datasheet	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
120-PRS13015-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2349	- + Добавить Расследования	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
47-PLS16021-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3632	- + Добавить Расследования	Datasheet	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
47-PRS16021-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3115	- + Добавить Расследования	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
121-PLS13013-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2678	- + Добавить Расследования	Datasheet	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
121-PLS13106-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2043	- + Добавить Расследования	Datasheet	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
121-PRS13013-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2185	- + Добавить Расследования	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
121-PRS13106-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2793	- + Добавить Расследования	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
510-13-400-20-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3411	- + Добавить Расследования	Datasheet	Bulk	510	Active	PGA	400 (20 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester