Продукты - Компания MX

Производитель. Часть #	Акции	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
123-13-636-41-001000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	2859	- + Добавить Расследования	Datasheet	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-0511-11 CONN SOCKET SIP 22POS GOLD Aries Electronics	3993	- + Добавить Расследования	Datasheet	Bulk	511	Active	SIP	22 (1 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
126-41-650-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3389	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-950-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2966	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-650-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2664	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-950-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2420	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-964-41-003000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	2107	- + Добавить Расследования	Datasheet	Tube	116	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-964-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3276	- + Добавить Расследования	Datasheet	Tube	116	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-322-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2058	- + Добавить Расследования		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-310-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2464	- + Добавить Расследования		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-310-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2145	- + Добавить Расследования		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
48-6556-30 UNIVERSAL TEST SOCKET 48POS Aries Electronics	3332	- + Добавить Расследования		-	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
48-6556-20 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2224	- + Добавить Расследования	Datasheet	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
48-3551-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3124	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3552-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	2949	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3553-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3371	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6551-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	2011	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6552-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3940	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3554-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3668	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6553-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	2519	- + Добавить Расследования	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled