Продукты - Компания MX

Производитель. Часть #	Акции	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
126-41-640-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2137	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-640-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2058	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-950-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3881	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-950-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3231	- + Добавить Расследования	Datasheet	Tube	126	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-650-41-780000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	2512	- + Добавить Расследования	Datasheet	Tube	104	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic
116-41-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2866	- + Добавить Расследования	Datasheet	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2793	- + Добавить Расследования	Datasheet	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-012-05-001001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3369	- + Добавить Расследования	Datasheet	Tube	510	Active	PGA	12 (5 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-952-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2464	- + Добавить Расследования	Datasheet	Tube	612	Active	DIP, 0.9 (22.86mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-952-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2215	- + Добавить Расследования	Datasheet	Tube	612	Active	DIP, 0.9 (22.86mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-223-18-091135 CONN SOCKET PGA 223POS GOLD Preci-Dip	3680	- + Добавить Расследования	Datasheet	Bulk	546	Active	PGA	223 (18 x 18)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-223-18-091136 CONN SOCKET PGA 223POS GOLD Preci-Dip	3758	- + Добавить Расследования	Datasheet	Bulk	546	Active	PGA	223 (18 x 18)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-224-18-091135 CONN SOCKET PGA 224POS GOLD Preci-Dip	3750	- + Добавить Расследования	Datasheet	Bulk	546	Active	PGA	224 (18 x 18)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-224-18-091136 CONN SOCKET PGA 224POS GOLD Preci-Dip	3476	- + Добавить Расследования	Datasheet	Bulk	546	Active	PGA	224 (18 x 18)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-179-18-111112 CONN SOCKET PGA 179POS GOLD Preci-Dip	2128	- + Добавить Расследования	Datasheet	Bulk	614	Active	PGA	179 (18 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-179-18-112112 CONN SOCKET PGA 179POS GOLD Preci-Dip	2215	- + Добавить Расследования	Datasheet	Bulk	614	Active	PGA	179 (18 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-3575-10 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2689	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6571-10 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2801	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6572-10 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3937	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6573-10 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3282	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled