Продукты - Компания MX

Производитель. Часть #	Акции	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
123-41-428-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3611	- + Добавить Расследования	Datasheet	Tube	123	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-628-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3366	- + Добавить Расследования	Datasheet	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-636-31-007000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	3997	- + Добавить Расследования	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-636-31-007000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	3888	- + Добавить Расследования	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3883-312-10-32 SER 6556 UNIV TEST SCKT RECEP Aries Electronics	3449	- + Добавить Расследования	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-422-G-M ADAPTER PLUG Samtec Inc.	3581	- + Добавить Расследования		Bulk	APA	Active	-	22 (2 x 11)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
210-41-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3560	- + Добавить Расследования	Datasheet	Tube	210	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3054	- + Добавить Расследования	Datasheet	Tube	210	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-642-41-001000 SOCKET IC OPEN 3 LVL .600 42POS Mill-Max Manufacturing Corp.	2592	- + Добавить Расследования		Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-642-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3795	- + Добавить Расследования	Datasheet	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-192-14-001135 CONN SOCKET PGA 192POS GOLD Preci-Dip	3201	- + Добавить Расследования	Datasheet	Bulk	546	Active	PGA	192 (14 x 14)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-192-14-001136 CONN SOCKET PGA 192POS GOLD Preci-Dip	2621	- + Добавить Расследования	Datasheet	Bulk	546	Active	PGA	192 (14 x 14)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-3571-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3502	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-3572-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3645	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-3573-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3719	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-3574-10 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	3662	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6571-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3153	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6572-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	2779	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6573-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	2434	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-3570-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3835	- + Добавить Расследования	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled